- 2023
-
- 03
- Received 'Excellent Public Disclosure Company' by KRX
- 2022
-
- 05
- SUSTIO(Malaysia) in full production
- 2015
-
- 07
- Conversion to a holding company
Company name changed to SIMMTECH Holdings Co., Ltd.
- 01
- Received "Best Partner Award" from Samsung Electronics
- 2014
-
- 10
- Received 'Excellent Cooperating Company Award' from SK hynix in its 2014 SK Hynix Shared Growth Day
- 02
- Received "Best in Class" Supplier from SanDisk for 4 years in a row
- Received 'Outstanding Partner Award' from Samsung Electronics
- 01
- Received 'Best Partnership' from TOSHIBA
- 2013
-
- 07
- Received 'Outstanding Site Award in Service and Support for 2012' from STATSChipPAC
- 06
- Received 'The Best Company in Creation of Employment' from KOSDAQ listed Companies Association
- 03
- Received "Best in Class" Supplier from SanDisk for 3 years in a row
- 02
- Received 'Excellent Public Disclosure Company' by KRX
- Selected as a 'Little-Big Company' from Samsung Electronics
- 2012
-
- 03
- Received "Micron Assembly Special Award" from Micron
- Received "Best in Class" Supplier from SanDisk
- 2011
-
- 12
- Received US$500 Million Export Award on 48th Trade Day
- 10
- Selected as an IR Excellent Company in 2011 by Korean IR Service
- 07
- Received Outstanding Partner Award from Micron System Integration
- 06
- SIMMTECH(XI'AN) Co., Ltd. in full production
- 05
- Selected as a 'Blue-chip Company' by KRX
- Selected as a 'Hidden Champion in KOSDAQ 2011' by KRX
- 03
- Received "Best in Class" Supplier from SanDisk
- 01
- Received Best Partners Award from Samsung Electronics
- 2010
-
- 11
- Received US$400 Million Export Award on 47th Trade Day
- 09
- SIMMTECH(XI'AN) Co., Ltd. raised US$30 Million from investors
- 07
- Established SIMMTECH HongKong Holdings and China plant, SIMMTECH ELECTRONICS (XI'AN) Co., Ltd.
- 04
- Received Best Award from Powertech Technology in Taiwan
- 2009
-
- 12
- Raised 30 billiion won of BW from institutional investors
- 11
- Received Best Supplier Award from Samsung Electronics
- 2008
-
- 12
- Selected as a Global Leading Products(Memory Module PCB, BOC) and Manufacturer by Ministry of Knowledge Economy
- 06
- Started a massive-scale supply to Toshiba
- 2007
-
- 11
- Selected as an IR Excellent Company for 2 years in a row(2006~2007) by Korean IR Service
- Received US$300 Million Export Award on 44th Trade Day
- 10
- Received the first Local Entrepreneur Award from the Chungbuk Province
- Received Excellent Cooperating Company Award from Hynix in its Partner's Day
- 09
- Factory #5 in full production
- 06
- Started a long-term supply to Elpida
- 2006
-
- 11
- Received US$200 Million Export Award on 43th Trade Day, Decorated Bronze Industrial Medal from the government
- 07
- Received Excellence Award in the 5th Technology Fast 50 Korea 2006
- 2005
-
- 08
- Factory #4 in full production(Ochang)
- 07
- Raised 5 billion won from Samsung Electronics in Korea
- 2004
-
- 12
- ISO 14001 Certificate acquired
- 11
- Received US$100 Million Export Award on 41th Trade Day, Decorated Iron Industrial Medal from the government
- 05
- Contract with LG Electronics to supply build-up boards
- 04
- Contract with SamsungTechwin to supply CSP
- 2003
-
- 12
- Strategic Alliance with STATS-supply and investment
- 09
- Selected by Nanya as a major vendor
- 07
- Factory #3 in full production
- 04
- Long term contract with Graphic PLC in UK
- 2002
-
- 05
- Completion of joint development of flip chip build-up BGA with CMK in Japan
- 04
- QS 9000 Certificate acquired
- 2001
-
- 08
- Strategic alliance with Tessera, Inc. of the U.S. for joint technology development
- 07
- Patent application filed for design of stacked wCSP package structure
- Patent application filed for PCB design to form Cu land for heat emission under wCSP structure
- Patent application filed for rigid board design to prevent die tilt in CSP packaging
- 04
- Patent applications filed in the US for PCB cleansing technology using plasma under normal circumstance
- 02
- Agreement on the development of Flip Chip build-up BGA with CMK in Japan
- 2000
-
- 07
- Strategic alliance with Rambus Inc. of the U.S. for joint technology development
- Strategic alliance with CMK of Japan for joint technology development
- 04
- Invested in Skion of the U.S. and signed into technological partnership
- Purchased land for factory expansion of 2.3 acres
- 01
- Agreement with Rambus Inc. for joint use of trademarks
- Initial public offering (IPO) on KOSDAQ exchange
- 1999
-
- 12
- Selected as model company for Labor Management Cooperation
- 08
- Factory #2 in full production
- 05
- Raised 26 billion won from Hangang Restructuring Fund
- 03
- Raised US$22 Million in equity-based initial foreign funding from AIG in the U.S.
- 01
- Received AAA rating from Seoul Bank and Shinhan Bank
- 1998
-
- 06
- CEO delivered a representative speech to American Venture Investment in NewYork
- 05
- Selected as a Venture Corporation(Patent-Technology Development Investment Corporation)
- 1997
-
- 12
- Received a participation prize in the 3rd Excellent Globalization Contest
- 11
- Received US$50 Million Export Award on 34th Trade Day
- 10
- Received 13th Jang Eun Technology Award
- 01
- SIMMTECH 2000 VISION
- 1996
-
- 12
- Received 100PPM Certificate
- 09
- First BGA(Ball Grid Array) production line completed in Korea
- 06
- Raised 1.5 billion won from Amkor in Korea
- 03
- Selected as model company for factory automation
- 1995
-
- 02
- Company name changed to SIMMTECH Co., Ltd.
- 1994
-
- 05
- BIB(Burn-in Board) production line completed
- 01
- ISO 9002 Certificate acquired
- 1993
-
- 07
- Research Center established
- 1990
-
- 11
- Received US$5 Million Export Award on 27th Trade Day
- 1988
-
- 09
- Completion of first manufacturing facility
- 1987
-
- 08
- Established as Chung-Buk Electronics, the predecessor of SIMMTECH